bat54j / w / aw / cw / sw ? june 1999 - ed: 2a small signal schottky diode very small conduction losses negligible switching losses low forward voltage drop surface mount device features and benefits schottky barrier diodes encapsulated either in sot-323 or sod-323 small smd packages. single and double diodes with different pining are available. description k a a nc nc k symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f continuous forward current 0.3 a i fsm surge non repetitive forward current tp=10ms sinusoidal 1 a p tot power dissipation (note 1) tamb = 25c sod-323 230 mw sot-323 t stg maximum storage temperature range - 65 to +150 c tj maximum operating junction temperature * 150 c t l maximum temperature for soldering during 10s 260 c note 1: for double diodes, ptot is the total dissipation of both diodes absolute ratings (limiting values) bat54w a1 a1 a2 a2 k k bat54cw a1 k2 a2 k1 a2 k1 k2 a1 bat54sw * : dptot dtj < 1 rth ( j - a ) thermal runaway condition for a diode on its own heatsink k1 k1 k2 k2 a a bat54aw bat54j a k 86 sot-323 sod-323 1/5
symbol parameters tests conditions min. typ. max. unit v f * forward voltage drop tj = 25 ci f = 0.1 ma 240 mv i f = 1 ma 320 i f = 10 ma 400 i f = 30 ma 500 i f = 100 ma 900 i r ** reverse leakage current tj = 25 cv r = 30 v 1 m a tj = 100 c 100 pulse test : * tp = 380 m s, d < 2% ** tp = 5 ms, d < 2% static electrical characteristics (per diode) symbol parameters tests conditions min. typ. max. unit c junction capacitance tj = 25 cv r = 1 v f = 1 mhz 10 pf t rr reverse recovery time i f = 10 ma i r = 10 ma tj = 25c i rr = 1 ma r l = 100 w 5ns dynamic characteristics (tj = 25 c) symbol parameters value unit r th (j-a) junction to ambient (*) sod-323 550 c/w sot-323 c/w (*) mounted on epoxy board, with recommended pad layout. thermal resistance 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.00e+0 2.00e-3 4.00e-3 6.00e-3 8.00e-3 1.00e-2 1.20e-2 1.40e-2 1.60e-2 1.80e-2 2.00e-2 vfm(v) ifm(a) tj=100c tj=50c tj=25c fig. 1-1: forward voltage drop versus forward current (typical values, low level). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1e-3 1e-2 1e-1 5e-1 vfm(v) ifm(a) tj=100c tj=50c tj=25c fig. 1-2: forward voltage drop versus forward current (typical values, high level). bat54j / w / aw / cw / sw 2/5
0 5 10 15 20 25 30 35 40 45 50 300 350 400 450 500 550 600 s(cu) (mm2) rth(j-a) (c/w) p=0.2w fig. 6: thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board fr4, copper thickness: 35 m m .) 0 5 10 15 20 25 30 1e-2 1e-1 1e+0 1e+1 1e+2 vr(v) ir(a) tj=50c tj=25c tj=100c fig. 2: reverse leakage current versus reverse voltage applied (typical values). 0 25 50 75 100 125 150 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 tj(c) ir(a) vr=30v fig. 3: reverse leakage current versus junction temperature. 12 5102030 1 2 5 10 vr(v) c(pf) f=1mhz tj=25c fig. 4: junction capacitance versus reverse voltage applied (typical values). 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 0.01 0.10 1.00 tp(s) zth(j-a)/rth(j-a) single pulse d = 0.1 d = 0.2 d = 0.5 t d =tp/t tp fig. 5: relative variation of thermal impedance junction to ambient versus pulse duration (epoxy fr4 with recommended pad layout, e(cu)=35 m m) bat54j / w / aw / cw / sw 3/5
package mechanical data sot-323 e c l h b d a a1 e q ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.8 1.1 0.031 0.043 a1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 d 1.8 2.0 2.2 0.071 0.079 0.086 e 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65 0.026 h 1.8 2.1 2.4 0.071 0.083 0.094 l 0.1 0.2 0.3 0.004 0.008 0.012 q 0 30 0 30 bat54j / w / aw / cw / sw 4/5
package mechanical data sod-323 h b d e a1 a l q1 c ref. dimensions millimeters inches min. max. min. max. a 1.17 0.046 a1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 d 1.52 1.8 0.06 0.071 e 1.11 1.45 0.044 0.057 h 2.3 2.7 0.09 0.106 l 0.1 0.46 0.004 0.02 q1 0.1 0.41 0.004 0.016 ordering type marking package weight base qty delivery mode bat54w d73 sot-323 0.006g 3000 tape & reel bat54aw d74 sot-323 0.006g 3000 tape & reel bat54cw d77 sot-323 0.006g 3000 tape & reel bat54sw d78 sot-323 0.006g 3000 tape & reel bat54j 86 sod-323 0.005g 3000 tape & reel epoxy meets ul94,v0 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1999 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com bat54j / w / aw / cw / sw 5/5
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